Fan-out semiconductor package

A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor...

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Bibliographic Details
Main Authors Lee, Gun, Lee, Jaekul, Cho, Bongju, Kang, Myungsam, Ko, Younggwan
Format Patent
LanguageEnglish
Published 05.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.
Bibliography:Application Number: US202117403233