Semiconductor package structure including antenna

An electronic device that has an antenna device that includes a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate, and a second antenna element formed on a second sur...

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Bibliographic Details
Main Authors Liu, Nai-Wei, Chi, Yen-Yao, Lin, Tzu-Hung
Format Patent
LanguageEnglish
Published 21.11.2023
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device that has an antenna device that includes a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate, and a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The electronic device further has a semiconductor package that includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer, a first electronic component electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first electronic component.
Bibliography:Application Number: US202218046218