Semiconductor device

A device includes a semiconductor chip, a molding compound, an insulating structure, an under-bump-metallurgy (UBM), a conductive ball, and a protection layer. The molding compound laterally surrounds the semiconductor chip. The insulating structure is over the semiconductor chip and the molding com...

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Bibliographic Details
Main Authors Kuo, Hung-Jui, Hu, Yu-Hsiang, Lan, Jo-Lin, Liu, Zi-Jheng
Format Patent
LanguageEnglish
Published 14.11.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A device includes a semiconductor chip, a molding compound, an insulating structure, an under-bump-metallurgy (UBM), a conductive ball, and a protection layer. The molding compound laterally surrounds the semiconductor chip. The insulating structure is over the semiconductor chip and the molding compound. The UBM is over the insulating structure and is electrically connected to the semiconductor chip. The conductive ball is in contact with the UBM. The protection layer extends from the UBM to the molding compound.
Bibliography:Application Number: US202117340036