Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip

A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed...

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Bibliographic Details
Main Authors Hong, Chii Shang, Tean, Ke Yan, Joanna Chye, Jo Ean, Lit, Hui Kin, Wang, Wei-Shan, Otremba, Ralf, Lee, Teck Sim, Wang, Lee Shuang
Format Patent
LanguageEnglish
Published 31.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The semiconductor die is disposed with the first main face on the carrier. A clip connects the second contact pad to the second external contact. A first bond wire is connected between the third contact pad and the first external contact. The first bond wire is disposed at least partially under the clip.
Bibliography:Application Number: US202017108079