Electronics enclosure for downhole tools
An electronics enclosure system includes a pressure housing with a thermally conductive material and a plurality of shells disposed within the pressure housing, wherein the plurality of shells are coupled together to form an enclosure, and wherein each shell of the plurality of shells comprises ther...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
24.10.2023
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Subjects | |
Online Access | Get full text |
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