Electronics enclosure for downhole tools

An electronics enclosure system includes a pressure housing with a thermally conductive material and a plurality of shells disposed within the pressure housing, wherein the plurality of shells are coupled together to form an enclosure, and wherein each shell of the plurality of shells comprises ther...

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Bibliographic Details
Main Authors Zimmerman, Mark A, Finke, Michael Dewayne, Agnihotri, Mukul M
Format Patent
LanguageEnglish
Published 24.10.2023
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Summary:An electronics enclosure system includes a pressure housing with a thermally conductive material and a plurality of shells disposed within the pressure housing, wherein the plurality of shells are coupled together to form an enclosure, and wherein each shell of the plurality of shells comprises thermally conductive material. The electronics enclosure system further includes at least one circuit board secured to an inner surface of a respective shell of the plurality of shells and a plurality of electronic components secured to the at least one circuit board, the plurality of shells, or some combination thereof.
Bibliography:Application Number: US202117538637