Semiconductor MEMS structure
The present disclosure provides a structure. The structure comprises a cavity enclosed by a first substrate and a second substrate opposite to the first substrate. Further, the structure includes a feature in the cavity and the feature is protruded from a surface of the first substrate. In addition,...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
26.09.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure provides a structure. The structure comprises a cavity enclosed by a first substrate and a second substrate opposite to the first substrate. Further, the structure includes a feature in the cavity and the feature is protruded from a surface of the first substrate. In addition, the structure includes a dielectric layer over the feature, wherein the dielectric layer includes a first surface in contact with the feature and a second surface opposite to the first surface is positioned toward the cavity. |
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Bibliography: | Application Number: US202016948641 |