Semiconductor device and method for fabricating the same
A method for fabricating semiconductor device includes the steps of first providing a substrate having a first region and a second region, forming a first bottom barrier metal (BBM) layer on the first region and the second region, forming a first work function metal (WFM) layer on the first BBM laye...
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| Main Authors | , , , , , , |
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| Format | Patent |
| Language | English |
| Published |
12.09.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A method for fabricating semiconductor device includes the steps of first providing a substrate having a first region and a second region, forming a first bottom barrier metal (BBM) layer on the first region and the second region, forming a first work function metal (WFM) layer on the first BBM layer on the first region and the second region, and then forming a diffusion barrier layer on the first WFM layer. |
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| AbstractList | A method for fabricating semiconductor device includes the steps of first providing a substrate having a first region and a second region, forming a first bottom barrier metal (BBM) layer on the first region and the second region, forming a first work function metal (WFM) layer on the first BBM layer on the first region and the second region, and then forming a diffusion barrier layer on the first WFM layer. |
| Author | Li, Yi-Fan Wu, Chih-Chiang Ho, Nien-Ting Huang, Wen-Yen Chen, Ti-Bin Wu, Zhen Chou, Shih-Min |
| Author_xml | – fullname: Wu, Zhen – fullname: Wu, Chih-Chiang – fullname: Chou, Shih-Min – fullname: Chen, Ti-Bin – fullname: Huang, Wen-Yen – fullname: Li, Yi-Fan – fullname: Ho, Nien-Ting |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Semiconductor device and method for fabricating the same |
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