Indium electroplating on physical vapor deposition tantalum
A method for fabricating a wafer stack. The method includes forming a tantalum-nitride film on a substrate of the wafer stack using physical vapor deposition, forming a tantalum layer on the tantalum-nitride film using physical vapor deposition, and depositing indium on the tantalum layer using elec...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
12.09.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A method for fabricating a wafer stack. The method includes forming a tantalum-nitride film on a substrate of the wafer stack using physical vapor deposition, forming a tantalum layer on the tantalum-nitride film using physical vapor deposition, and depositing indium on the tantalum layer using electroplating. |
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Bibliography: | Application Number: US202017098560 |