Electrically conductive element
A microelectronic device is provided, including: a support; and an electrically conductive element including in a stack and successively above a first face of the support, a first layer based on a metal and a second layer, in contact with the first layer, based on a material selected from among MoSi...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
05.09.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A microelectronic device is provided, including: a support; and an electrically conductive element including in a stack and successively above a first face of the support, a first layer based on a metal and a second layer, in contact with the first layer, based on a material selected from among MoSi and WSiy. A method for manufacturing the microelectronic device is also provided. |
---|---|
Bibliography: | Application Number: US202017097730 |