Semiconductor bonding structures and methods

A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the und...

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Bibliographic Details
Main Authors Cheng, Ming-Da, Lin, Wei-Hung, Chen, Meng-Tse, Huang, Kuei-Wei, Lin, Hsiu-Jen, Liu, Chung-Shi
Format Patent
LanguageEnglish
Published 05.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.
Bibliography:Application Number: US201816046211