Semiconductor package device

A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interpo...

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Bibliographic Details
Main Authors Bae, Gun-Hee, Choi, Deok-Seon, Choi, Il-Joo, Noh, Hyunggyun, Bae, Jinsoo, Pae, Sangwoo
Format Patent
LanguageEnglish
Published 22.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.
Bibliography:Application Number: US202117505953