3D semiconductor device and structure with single-crystal layers
A 3D semiconductor device, the device comprising: a first level comprising a first single crystal layer, said first level comprising first transistors, wherein each of said first transistors comprises a single crystal channel; first metal layers interconnecting at least said first transistors; a sec...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
22.08.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A 3D semiconductor device, the device comprising: a first level comprising a first single crystal layer, said first level comprising first transistors, wherein each of said first transistors comprises a single crystal channel; first metal layers interconnecting at least said first transistors; a second metal layer overlaying said first metal layers; and a second level comprising a second single crystal layer, said second level comprising second transistors, wherein said second level overlays said first level, wherein at least one of said second transistors comprises a gate all around structure, wherein said second level is directly bonded to said first level, and wherein said bonded comprises direct oxide to oxide bonds. |
---|---|
Bibliography: | Application Number: US202218088602 |