Multilayer electronic component

A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode l...

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Bibliographic Details
Main Authors Ahn, Jin Mo, Jeong, Eun Hee, Jeong, Do Young, An, Ga Young
Format Patent
LanguageEnglish
Published 22.08.2023
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Summary:A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode layer and the plating layer of the connection portion of the external electrode.
Bibliography:Application Number: US202117470242