Multilayer electronic component
A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode l...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
22.08.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode layer and the plating layer of the connection portion of the external electrode. |
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Bibliography: | Application Number: US202117470242 |