Silicon-containing underlayers

Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-...

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Bibliographic Details
Main Authors Yamada, Shintaro, Cameron, James F, Greene, Daniel, Coley, Suzanne M, Cui, Li, LaBeaume, Paul J, Cutler, Charlotte A
Format Patent
LanguageEnglish
Published 22.08.2023
Subjects
ADHESIVES
APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
CINEMATOGRAPHY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
CORRECTING FLUIDS
DYES
ELECTROGRAPHY
FILLING PASTES
HOLOGRAPHY
INKS
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.
Bibliography:Application Number: US202117370541