Semiconductor device under bump structure and method therefor

• Main Authors: Lo, Tsung Nan, Tay, Sharon Huey Lin, Macatangay, Antonio Aguinaldo Marquez
• Format: Patent
• Language: English
• Published: 15.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of manufacturing a semiconductor device is provided. The method includes depositing a non-conductive layer over a semiconductor die. An opening is formed in the non-conductive layer exposing a portion of a bond pad of the semiconductor die. A cavity is in the non-conductive layer with a por...