Chip package structure with ring structure and method for forming the same

• Main Authors: Yeh, Shu-Shen, Lin, Yi-Hang, Yang, Che-Chia, Lai, Po-Chen, Wang, Chin-Hua, Lin, Po-Yao, Lee, Kuang-Chun, Jeng, Shin-Puu
• Format: Patent
• Language: English
• Published: 15.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for forming a chip package structure is provided. The method includes disposing a first chip structure and a second chip structure over a wiring substrate. The first chip structure is spaced apart from the second chip structure by a gap. The method includes disposing a ring structure over the wiring substrate. The ring structure has a first opening, the first chip structure and the second chip structure are in the first opening, the first opening has a first inner wall, the first inner wall has a first recess, and the gap extends toward the first recess.