Protective liner layers in 3D memory structure

A memory device includes a stack of gate electrode layers and interconnect layers arranged over a substrate. A first memory cell that is arranged over the substrate includes a first source/drain conductive lines and a second source/drain conductive line extending vertically through the stack of gate...

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Bibliographic Details
Main Authors Sun, Hung-Chang, Wu, Chen-Jun, Yang, Feng-Cheng, Yang, Tsu Ching, Lai, Sheng-Chih, Jiang, Yu-Wei, Lin, Chung-Te, Chiang, Kuo-Chang
Format Patent
LanguageEnglish
Published 08.08.2023
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Summary:A memory device includes a stack of gate electrode layers and interconnect layers arranged over a substrate. A first memory cell that is arranged over the substrate includes a first source/drain conductive lines and a second source/drain conductive line extending vertically through the stack of gate electrode layers. A channel layer and a memory layer are arranged on outer sidewalls of the first and second source/drain conductive lines. A first barrier structure is arranged between the first and second source/drain conductive lines. A first protective liner layer separates the first barrier structure from each of the first and second source/drain conductive lines. A second barrier structure is arranged on an opposite side of the first source/drain conductive line and is spaced apart from the first source/drain conductive line by a second protective liner layer.
Bibliography:Application Number: US202117190735