Printed circuit board and method of fabricating the same

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

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Bibliographic Details
Main Authors Choi, Dae Young, Lee, Sang Young, Lee, Han Su, Bae, Yun Mi, Kwon, Soon Gyu, Kim, Sang Hwa, Jeong, In Ho, Jeong, Dong Hun, Lee, Jin Hak, Hwang, Jung Ho
Format Patent
LanguageEnglish
Published 08.08.2023
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
Bibliography:Application Number: US202217653054