Curable composition, and production method of joined structure

Provided are a curable composition that exhibits favorable adhesiveness without heating at elevated temperatures, and a method for producing a joined structure using the curable composition. As a curable composition for use in forming one or more bonding layers bonding the two or more adherends, in...

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Bibliographic Details
Main Author Kurosawa, Tsuyoshi
Format Patent
LanguageEnglish
Published 08.08.2023
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:Provided are a curable composition that exhibits favorable adhesiveness without heating at elevated temperatures, and a method for producing a joined structure using the curable composition. As a curable composition for use in forming one or more bonding layers bonding the two or more adherends, in which at least one of the two or more adherends includes a low heat-resistance material, a curable composition that contains an epoxy resin including a structural unit of a specific structure including an epoxy group, and yields a cured product exhibiting a water contact angle of 40° or more and 50° or less by heating at 80° C. or higher and 100° C. or lower and an exposure is used.
Bibliography:Application Number: US202117550254