Multi-layer interconnection ribbon

• Main Authors: Jocson, Emil Lamco, Comadre, Ryan Tordillo, Bajuri, Mohd Kahar
• Format: Patent
• Language: English
• Published: 18.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package assembly includes a carrier with a die attach surface and a contact pad separated from the die attach surface, a semiconductor die mounted on the die attach surface, the semiconductor die having a front side metallization that faces away from the die attach surface, an interconnect ribbon attached to the semiconductor die and the contact pad such that the interconnect ribbon electrically connects the front side metallization to the contact pad, and an electrically insulating encapsulant body that encapsulates the semiconductor die and at least part of the interconnect ribbon. The interconnect ribbon includes a layer stack of a first metal layer and a second layer formed on top of the first metal layer. The first metal layer includes a different metal as the second metal layer. The first metal layer faces the front side metallization.