Chamfered die of semiconductor package and method for forming the same

A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes...

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Bibliographic Details
Main Authors Yu, Chen-Hua, Kuo, Tin-Hao, Chen, Shih-Wei, Hsieh, Wei-Kang, Tsai, Hao-Yi
Format Patent
LanguageEnglish
Published 20.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.
Bibliography:Application Number: US202016926215