Integrated circuit (IC) package with stacked die wire bond connections, and related methods

An integrated circuit (IC) package with stacked die wire bond connections has two stacked IC dies, where a first die couples to a metallization structure directly and a second die stacked on top of the first die connects to the metallization structure through wire bond connections. The IC dies are c...

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Bibliographic Details
Main Authors Kim, Michelle Yejin, Tong, Jialing, Kang, Kuiwon, Buot, Joan Rey Villarba
Format Patent
LanguageEnglish
Published 13.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit (IC) package with stacked die wire bond connections has two stacked IC dies, where a first die couples to a metallization structure directly and a second die stacked on top of the first die connects to the metallization structure through wire bond connections. The IC dies are coupled to one another through an interior metal layer of the metallization structure. Vias are used to couple to the interior metal layer.
Bibliography:Application Number: US202117158374