Substrate support assembly with arc resistant coolant conduit
Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamb...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
09.05.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 MΩ. |
---|---|
Bibliography: | Application Number: US202016825466 |