Electronic component embedded substrate

• Main Authors: Jang, Jun Hyeong, Park, Yeo Il, Byun, Dae Jung, Park, Chang Hwa, Lee, Yong Duk, Jeong, Sang Ho, Na, Ki Ho, Park, Je Sang, Cha, Yoo Rim, Hwang, Mi Sun
• Format: Patent
• Language: English
• Published: 02.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.