Cleaning method of glass substrate, manufacturing method of semiconductor device, and glass substrate

A glass substrate is reused. The mass productivity of a semiconductor device is increased.A glass substrate one surface of which includes a first material and a second material. The first material includes one or both of a metal and a metal oxide. The second material includes one or both of a resin...

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Bibliographic Details
Main Authors Yamazaki, Shunpei, Sato, Masataka, Takase, Natsuko, Idojiri, Satoru
Format Patent
LanguageEnglish
Published 25.04.2023
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A glass substrate is reused. The mass productivity of a semiconductor device is increased.A glass substrate one surface of which includes a first material and a second material. The first material includes one or both of a metal and a metal oxide. The second material includes one or both of a resin and a decomposition product of a resin. A cleaning method of a glass substrate, which includes a step of preparing the glass substrate one surface of which includes a first material and a second material and a step of exposing the first material by removing at least part of the second material.
Bibliography:Application Number: US201716332546