High-density optical communications using multi-core fiber

A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured t...

Full description

Saved in:
Bibliographic Details
Main Authors Atias, Boaz, Bakopoulos, Paraskevas, Kalavrouziotis, Dimitrios, Mentovich, Elad, Becker, Donald
Format Patent
LanguageEnglish
Published 18.04.2023
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
TRANSMISSION
Online AccessGet full text

Cover

More Information
Summary:A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect includes multiple fiber cores for routing the plurality of optical communication signals between the MCM and the panel. The MCF has a first end at which the multiple fiber cores are coupled to the MCM, and a second end at which the multiple fiber cores are connected to the optical-to-optical connector on the panel.
Bibliography:Application Number: US202117315312