Semiconductor package

A semiconductor package includes a first semiconductor chip in which a through-electrode is provided, a second semiconductor chip connected to a top surface of the first semiconductor chip, a first connection bump attached to a bottom surface of the first semiconductor chip and including a first pil...

Full description

Saved in:
Bibliographic Details
Main Authors Seo, Sun-kyoung, Jo, Cha-jea, Ha, Soo-hyun
Format Patent
LanguageEnglish
Published 21.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor package includes a first semiconductor chip in which a through-electrode is provided, a second semiconductor chip connected to a top surface of the first semiconductor chip, a first connection bump attached to a bottom surface of the first semiconductor chip and including a first pillar structure and a first solder layer, and a second connection bump located between the first semiconductor chip and the second semiconductor chip, configured to electrically connect the first semiconductor chip and the second semiconductor chip, and including a second pillar structure and a second solder layer.
Bibliography:Application Number: US202117213715