Geometrically configurable planar wafers

A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edg...

Full description

Saved in:
Bibliographic Details
Main Authors Kendall, Tristan J, Stowe, Steven, Deloy, Jeffrey J, Gerdes, Joshua, Mayfield, James B
Format Patent
LanguageEnglish
Published 07.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
Online AccessGet full text

Cover

More Information
Summary:A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edge connections. Alternatively, or in addition, the asymmetries include differences in copper disposition to certain edge connections. Each modular component has a non-conductive coating on each side of the wafer to insulate the underlaying copper layer.
Bibliography:Application Number: US202016751830