Methods for forming semiconductor devices

• Main Authors: Chang, Pei-Yu, Liao, Chih-Cherng, Kan, Kai-Chuan, Kuo, Ya-Huei, Lee, I-Ping, Lee, Tsung-Hsiung, Wu, Zheng-Xian, Liu, Yow-Shiuan, Lin, Kwang-Ming, Chang, Ya-Ting, Chang, Yu-Jui
• Format: Patent
• Language: English
• Published: 31.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods of forming semiconductor devices are provided. The methods include: forming a trench in a substrate, wherein the trench includes a defect protruding from a bottom surface of the trench; forming a flowable material on the substrate to at least partially cover the defect; performing an etching...