Electroplating method

The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with...

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Bibliographic Details
Main Authors He, Cheng-Rong, Chen, Jian-Rong, Peng, Kun-Cheng, Shih, Wei-Chuan, Chen, Ting-Han, Su, Dong-Qing
Format Patent
LanguageEnglish
Published 10.01.2023
Subjects
APPARATUS THEREFOR
BEER
BIOCHEMISTRY
CHEMISTRY
COMPOSITIONS THEREOF
CULTURE MEDIA
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
ENZYMOLOGY
METALLURGY
MICROBIOLOGY
MICROORGANISMS OR ENZYMES
MUTATION OR GENETIC ENGINEERING
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
PROPAGATING, PRESERVING OR MAINTAINING MICROORGANISMS
SPIRITS
VINEGAR
WINE
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Summary:The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.
Bibliography:Application Number: US202217686433