Plasma parameters and skew characterization by high speed imaging

Embodiments of the present disclosure relate to a method and an apparatus for monitoring plasma behavior inside a plasma processing chamber. In one example, a method for monitoring plasma behavior includes acquiring at least one image of a plasma, and determining a plasma parameter based on the at l...

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Bibliographic Details
Main Authors Singh, Anup Kumar, Kumar, Bhaskar, Balasubramanian, Ganesh, Bhatia, Sidharth, Shah, Vivek Bharat, Hammond, IV, Edward P
Format Patent
LanguageEnglish
Published 03.01.2023
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:Embodiments of the present disclosure relate to a method and an apparatus for monitoring plasma behavior inside a plasma processing chamber. In one example, a method for monitoring plasma behavior includes acquiring at least one image of a plasma, and determining a plasma parameter based on the at least one image.
Bibliography:Application Number: US202016940957