Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates
A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that containing useful devices coupled to a semiconductive device.
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
27.12.2022
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that containing useful devices coupled to a semiconductive device. |
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| AbstractList | A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that containing useful devices coupled to a semiconductive device. |
| Author | Kong, Jackson Chung Peng Cheah, Bok Eng Kuan, Chin Lee |
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| Notes | Application Number: US201916450307 |
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| RelatedCompanies | Intel Corporation |
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| Snippet | A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates |
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