Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates
A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that containing useful devices coupled to a semiconductive device.
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
27.12.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that containing useful devices coupled to a semiconductive device. |
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Bibliography: | Application Number: US201916450307 |