Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates

A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that containing useful devices coupled to a semiconductive device.

Saved in:
Bibliographic Details
Main Authors Cheah, Bok Eng, Kong, Jackson Chung Peng, Kuan, Chin Lee
Format Patent
LanguageEnglish
Published 27.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A multiple-damascene structure is located below a semiconductor device footprint on a printed wiring board, where the structure includes multiple recesses that containing useful devices coupled to a semiconductive device.
Bibliography:Application Number: US201916450307