System and method for high power diode based additive manufacturing

The present disclosure relates to a system for performing an Additive Manufacturing (AM) fabrication process on a powdered material (PM) forming a substrate. The system uses a first optical subsystem to generate an optical signal comprised of electromagnetic (EM) radiation sufficient to melt or sint...

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Bibliographic Details
Main Authors El-Dasher, Bassem S, Bayramian, Andrew, Demuth, James A, Farmer, Joseph C, Torres, Sharon G
Format Patent
LanguageEnglish
Published 27.12.2022
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Summary:The present disclosure relates to a system for performing an Additive Manufacturing (AM) fabrication process on a powdered material (PM) forming a substrate. The system uses a first optical subsystem to generate an optical signal comprised of electromagnetic (EM) radiation sufficient to melt or sinter a PM of the substrate. The first optical subsystem is controlled to generate a plurality of different power density levels, with a specific one being selected based on a specific PM forming a powder bed being used to form a 3D part. At least one processor controls the first optical subsystem and adjusts a power density level of the optical signal, taking into account a composition of the PM. A second optical subsystem receives the optical signal from the first optical subsystem and controls the optical signal to help facilitate melting of the PM in a layer-by-layer sequence of operations.
Bibliography:Application Number: US201916728929