Semiconductor device and wiring structure

A semiconductor device includes first and second wiring layers, and first and second via plugs. The first wiring layer has parallel tracks along which wirings are laid out, the tracks including first and second outer tracks and an inner track between the first and second outer tracks, the wirings in...

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Bibliographic Details
Main Authors Nasu, Hiroshi, Nakao, Kouji, Hasegawa, Tomohiro
Format Patent
LanguageEnglish
Published 20.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes first and second wiring layers, and first and second via plugs. The first wiring layer has parallel tracks along which wirings are laid out, the tracks including first and second outer tracks and an inner track between the first and second outer tracks, the wirings including a first line laid out along the first outer track and having an end portion that is laid out along the first outer track, and a second line laid out along the inner track and having an end portion that is laid out along the first outer track. The first via plug is in contact with the end portion of the first line and extends between the first and second wiring layers, and the second via plug is in contact with the end portion of the second line and extends between the first and second wiring layers.
Bibliography:Application Number: US202117183813