Pressure sensitive adhesive assembly comprising filler material

The present disclosure relates to a pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer comprising a hollow non-porous particulate filler material, wherein the surface of the hollow non-porous particulate filler material is provided with a hydrophobic s...

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Bibliographic Details
Main Authors Iyer, Suresh S, Heimink, Jan, Pandey, Ruchi, Wieneke, Jan U, Goeb, Siegfried R, Sikora, Regina, Forster, Jan D, Kuester, Frank, Unverhau, Kerstin, Eckhardt, Doreen
Format Patent
LanguageEnglish
Published 06.12.2022
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
PREPARATION OF CARBON BLACK
THEIR PREPARATION OR CHEMICAL WORKING-UP
TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
USE OF MATERIALS AS ADHESIVES
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Summary:The present disclosure relates to a pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer comprising a hollow non-porous particulate filler material, wherein the surface of the hollow non-porous particulate filler material is provided with a hydrophobic surface modification. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly.
Bibliography:Application Number: US201414888810