Piezoelectric devices fabricated in packaging build-up layers

Piezoelectric devices are described fabricated in packaging buildup layers. In one example, a package has a plurality of conductive routing layers and a plurality of organic dielectric layers between the conductive routing layers. A die attach area has a plurality of vias to connect to a microelectr...

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Bibliographic Details
Main Authors Eid, Feras, Liff, Shawna M
Format Patent
LanguageEnglish
Published 22.11.2022
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:Piezoelectric devices are described fabricated in packaging buildup layers. In one example, a package has a plurality of conductive routing layers and a plurality of organic dielectric layers between the conductive routing layers. A die attach area has a plurality of vias to connect to a microelectronic die, the vias connecting to respective conductive routing layers. A piezoelectric device is formed on an organic dielectric layer, the piezoelectric device having at least one electrode coupled to a conductive routing layer.
Bibliography:Application Number: US201916397356