Resistive random access memory and method of manufacturing the same

Provided are a resistive random access memory and a method of manufacturing the same. The resistive random access memory includes a stacked structure and a bit line structure. The stacked structure is disposed on a substrate. The stacked structure includes a bottom electrode, a top electrode and a r...

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Bibliographic Details
Main Authors Wu, Bo-Lun, Tsai, Shih-Ning, Kuo, Tse-Mian, Hsu, Po-Yen
Format Patent
LanguageEnglish
Published 08.11.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Summary:Provided are a resistive random access memory and a method of manufacturing the same. The resistive random access memory includes a stacked structure and a bit line structure. The stacked structure is disposed on a substrate. The stacked structure includes a bottom electrode, a top electrode and a resistance-switching layer. The bottom electrode is disposed on the substrate. The top electrode is disposed on the bottom electrode. The resistance-switching layer is disposed between the bottom electrode and the top electrode. The bit line structure covers a top surface of the stacked structure and covers a portion of a sidewall of the stacked structure. The bit line structure is electrically connected to the stacked structure.
Bibliography:Application Number: US202016919047