Subring for semiconductor dies
A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends through the base and has a second diameter at least as large as the first diameter. A projection extends from the base to ends positioned on opposi...
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| Main Authors | , , , , , |
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| Format | Patent |
| Language | English |
| Published |
25.10.2022
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends through the base and has a second diameter at least as large as the first diameter. A projection extends from the base to ends positioned on opposite sides of the base. The projection is adapted to clamp the tape to the frame and adapted to prevent relative movement between the tape, the subring, and the frame. |
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| AbstractList | A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends through the base and has a second diameter at least as large as the first diameter. A projection extends from the base to ends positioned on opposite sides of the base. The projection is adapted to clamp the tape to the frame and adapted to prevent relative movement between the tape, the subring, and the frame. |
| Author | Sherbin, Matthew John Wyant, Michael Todd Stepniak, Dave Charles Yano, Genki Hiroyuki, Sada Iriguchi, Shoichi |
| Author_xml | – fullname: Stepniak, Dave Charles – fullname: Hiroyuki, Sada – fullname: Iriguchi, Shoichi – fullname: Sherbin, Matthew John – fullname: Yano, Genki – fullname: Wyant, Michael Todd |
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| Notes | Application Number: US202117184553 |
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| RelatedCompanies | Texas Instruments Incorporated |
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| Snippet | A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Subring for semiconductor dies |
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