Subring for semiconductor dies

A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends through the base and has a second diameter at least as large as the first diameter. A projection extends from the base to ends positioned on opposi...

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Bibliographic Details
Main Authors Stepniak, Dave Charles, Hiroyuki, Sada, Iriguchi, Shoichi, Sherbin, Matthew John, Yano, Genki, Wyant, Michael Todd
Format Patent
LanguageEnglish
Published 25.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends through the base and has a second diameter at least as large as the first diameter. A projection extends from the base to ends positioned on opposite sides of the base. The projection is adapted to clamp the tape to the frame and adapted to prevent relative movement between the tape, the subring, and the frame.
Bibliography:Application Number: US202117184553