Interconnect substrate and method of making the same

An interconnect substrate includes an insulating layer and an interconnect layer formed on a surface of the insulating layer, wherein the surface of the insulating layer has grooves formed therein, the grooves having a meander shape on an order of nanometers in a plan view, and wherein the interconn...

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Bibliographic Details
Main Authors Yamasaki, Tomoo, Fukasawa, Ryo
Format Patent
LanguageEnglish
Published 04.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An interconnect substrate includes an insulating layer and an interconnect layer formed on a surface of the insulating layer, wherein the surface of the insulating layer has grooves formed therein, the grooves having a meander shape on an order of nanometers in a plan view, and wherein the interconnect layer has anchor portions fitted into the grooves.
Bibliography:Application Number: US202017076063