Electronic device having a composite structure
Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an ex...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English |
Published |
16.08.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material. |
---|---|
AbstractList | Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material. |
Author | Rammah, Marwan Misra, Abhijeet Spraggs, Ian A Osborne, Steven J Counts, William A |
Author_xml | – fullname: Osborne, Steven J – fullname: Misra, Abhijeet – fullname: Spraggs, Ian A – fullname: Counts, William A – fullname: Rammah, Marwan |
BookMark | eNrjYmDJy89L5WTQc81JTS4pys_LTFZISS3LTE5VyEgsy8xLV0hUSM7PLcgvzixJVSguKSpNLiktSuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGJoYWZsYWTkbGxKgBAAu0LME |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences Physics |
ExternalDocumentID | US11418638B2 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US11418638B23 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:25:53 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US11418638B23 |
Notes | Application Number: US201916569525 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220816&DB=EPODOC&CC=US&NR=11418638B2 |
ParticipantIDs | epo_espacenet_US11418638B2 |
PublicationCentury | 2000 |
PublicationDate | 20220816 |
PublicationDateYYYYMMDD | 2022-08-16 |
PublicationDate_xml | – month: 08 year: 2022 text: 20220816 day: 16 |
PublicationDecade | 2020 |
PublicationYear | 2022 |
RelatedCompanies | Apple Inc |
RelatedCompanies_xml | – name: Apple Inc |
Score | 3.423097 |
Snippet | Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY PHYSICS TELEPHONIC COMMUNICATION |
Title | Electronic device having a composite structure |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220816&DB=EPODOC&locale=&CC=US&NR=11418638B2 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5Kfd40KlofRJDcok2arskhCHlRhD6wjfRW8pgWPaTFRPz7zqxp60Wvu7DMLjuv3fm-AbhzLAcTAw1dPOaoU75h6o6FZAwT0TbT1MBcsu33B6IXW8_T7rQB72ssjOQJ_ZLkiKRRGel7Je31avuIFcjayvIhfaOh5VM0cQOtzo5Nk_tIaIHnhqNhMPQ133fjsTZ4cSnsN2y6ax6Z6x0Oo5lnP3z1GJWy-u1SoiPYHdFqRXUMDSwUOPDXndcU2O_XH94K7MkKzaykwVoLyxO4Dze9a9QcWdVVxtoXCzVRuUSc67BQ_WGG_fzAU7iNwonf00mE2Wa_s3i8lbZzBs1iWeA5o6s7mUUeN3WchLHIto0U3GRZOxHzrj0XF9D6e53Wf5OXcMhnx0-lhriCJsmH1-Rrq_RGHtI3ZISCdg |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4NAEJ409VFvihqtL0wMN7RQuoUDMeEV1EIbC6Y3wmNr9EAbwfj3nV1p60Wvu8lmdrPz2p3vG4AbQzNoqlBFJsOCyphvqLKhUTSGKempWabQgrPtByHxY-1xNpi14H2FheE8oV-cHBE1Kkd9r7m9Xm4esRxeW1ndZW84tLj3ItORmuxYVVkfCcmxTHcydsa2ZNtmPJXCZxPDfkXHu2ahud4aYkrIePbdF4uhUpa_XYq3D9sTXK2sD6BFSwE69qrzmgC7QfPhLcAOr9DMKxxstLA6hFt33btGLChTdZFh7ctXMRVZiTirw6LiDzPs5wc9gmvPjWxfRhGS9X6TeLqRtn8M7XJR0hOGru7nGnrczDBShkXWdYrBTZ73UjIf6HNyCt2_1-n-N3kFHT8KRsnoIXw6gz12juzZVCHn0EZZ6QX63Tq75Af2DaQ-hWE |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Electronic+device+having+a+composite+structure&rft.inventor=Osborne%2C+Steven+J&rft.inventor=Misra%2C+Abhijeet&rft.inventor=Spraggs%2C+Ian+A&rft.inventor=Counts%2C+William+A&rft.inventor=Rammah%2C+Marwan&rft.date=2022-08-16&rft.externalDBID=B2&rft.externalDocID=US11418638B2 |