Electronic device having a composite structure

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an ex...

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Bibliographic Details
Main Authors Osborne, Steven J, Misra, Abhijeet, Spraggs, Ian A, Counts, William A, Rammah, Marwan
Format Patent
LanguageEnglish
Published 16.08.2022
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
PHYSICS
TELEPHONIC COMMUNICATION
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Summary:Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.
Bibliography:Application Number: US201916569525