Package comprising a substrate configured as a heat spreader
A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spread...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English |
Published |
02.08.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device. |
---|---|
Bibliography: | Application Number: US202016789272 |