Solid-state imaging element, method for manufacturing the same, and electronic apparatus

• Main Authors: Yoshida, Shinichi, Honda, Hideyuki, Hirano, Tomoyuki, Tanaka, Yusuke, Kudoh, Yoshiharu, Ueda, Yoichi, Nakanishi, Kosuke, Nomura, Hirotoshi, Uchida, Tetsuya, Wakano, Toshifumi
• Format: Patent
• Language: English
• Published: 26.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

The present technology relates to a solid-state imaging element configured so that pixels can be more reliably separated, a method for manufacturing the solid-state imaging element, and an electronic apparatus.The solid-state imaging element includes a photoelectric converter, a first separator, and a second separator. The photoelectric converter is configured to perform photoelectric conversion of incident light. The first separator configured to separate the photoelectric converter is formed in a first trench formed from a first surface side. The second separator configured to separate the photoelectric converter is formed in a second trench formed from a second surface side facing a first surface. The present technology is applicable to an individual imaging element mounted on, e.g., a camera and configured to acquire an image of an object.