Low viscosity compositions and 3D printing methods utilizing the compositions

• Main Authors: Zhu, Bizhong, Degroot, Jr., Jon V, Joffre, Eric, Jang, Eun Sil
• Format: Patent
• Language: English
• Published: 19.07.2022
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; ADHESIVES; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A composition for forming a silicone elastomer is disclosed. The composition comprises: A) a linear organopolysiloxane having at least two silicon-bonded ethylenically unsaturated groups per molecule; B) a linear organohydrogensiloxane having at least two silicon-bonded hydrogen atoms per molecule; C) at least one cross-linker; and D) a hydrosilylation catalyst. The cross-linker C) is selected from the group consisting of: C1) an organopolysiloxane having at least three silicon-bonded ethylenically unsaturated groups per molecule; and C2) an organopolysiloxane having at least three silicon-bonded hydrogen atoms per molecule. At least one of the silicon-bonded ethylenically unsaturated groups of component C1) has a lower reactivity relative to the silicon-bonded ethylenically unsaturated groups of component A). Moreover, at least one of the silicon-bonded hydrogen atoms of component C2) has a lower reactivity relative to the silicon-bonded hydrogen atoms of component B). Methods of forming three-dimensional (3D) articles utilizing the compositions are also disclosed.