Hardware packaging
A hardware packaging assembly and method are provided. A hardware component has a front appearance surface and a back mounting surface. A package backing has a forward receiving surface to receive the back mounting surface of the hardware component. A retention feature protrudes from the package bac...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
19.07.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A hardware packaging assembly and method are provided. A hardware component has a front appearance surface and a back mounting surface. A package backing has a forward receiving surface to receive the back mounting surface of the hardware component. A retention feature protrudes from the package backing to engage the hardware component with an interference fit. The retention feature retains the hardware component on the package backing while maintaining the front appearance surface exposed. |
---|---|
Bibliography: | Application Number: US201816028914 |