Hardware packaging

A hardware packaging assembly and method are provided. A hardware component has a front appearance surface and a back mounting surface. A package backing has a forward receiving surface to receive the back mounting surface of the hardware component. A retention feature protrudes from the package bac...

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Bibliographic Details
Main Authors Daniels, James Leroy, Pruitt, II, James William, Martin, Ryan Patrick
Format Patent
LanguageEnglish
Published 19.07.2022
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Summary:A hardware packaging assembly and method are provided. A hardware component has a front appearance surface and a back mounting surface. A package backing has a forward receiving surface to receive the back mounting surface of the hardware component. A retention feature protrudes from the package backing to engage the hardware component with an interference fit. The retention feature retains the hardware component on the package backing while maintaining the front appearance surface exposed.
Bibliography:Application Number: US201816028914