Mount component and module

Provided is a mount component that is for forming a directional coupler consisting of a main line and a sub line. Out of the main line and the sub line, only the sub line is formed on or in the mount component. The main line is formed on or in a mounting substrate on which the mount component is mou...

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Bibliographic Details
Main Author Tomita, Takayuki
Format Patent
LanguageEnglish
Published 12.07.2022
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Summary:Provided is a mount component that is for forming a directional coupler consisting of a main line and a sub line. Out of the main line and the sub line, only the sub line is formed on or in the mount component. The main line is formed on or in a mounting substrate on which the mount component is mounted and is not formed on or in the mount component. When the mount component is mounted on the mounting substrate, the main line and the sub line electromagnetically couple with each other and as a result a directional coupler is formed.
Bibliography:Application Number: US202016850163