Wafer chuck and processing arrangement
According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surroundin...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
12.07.2022
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Subjects | |
Online Access | Get full text |
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Summary: | According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surrounding the receiving area configured to retain the wafer in the receiving area. |
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Bibliography: | Application Number: US202016798445 |